Automatically verified and published · Generated and evidence-checked automatically; not reviewed by a human.
Nanya Technology announced plans to invest in a 3D wafer packaging and testing plant at Pingtung Science Park. The facility is set to use through-silicon vias and wafer stacking for wafer-level packaging and testing, targeting demand for high-performance, high-bandwidth memory driven by AI applications.
IT之家 10 月 5 日消息，DRAM 内存芯片与模组制造商南亚科技 (Nanya Technology) 本月 1 日宣布，将在屏东科学园区投资设立 3D 晶圆封装测试厂。 这座先进封测设施将导入 TSV（硅通孔）、晶圆堆叠等 3D IC 先进技术，布局晶圆级 (Wafer Level) 封装与测试的专业制造整合能力，以满足 AI 应用快速发展所带动的高性能、高带宽内存需求。 IT之家注意到，从描述上来看，南亚科技的这种新后端工厂将瞄准“类 HBM”的内存解决方案，有望拿下各类 AI 芯片的订单。